Description |
Capabilities |
Product Range
|
1 - 30 layers circuit board (PCB)s (Automatic quoting to 12 layers) |
Base Material
|
FR-4 Glass Epoxy laminate High Frequency PTFE(Teflon) Aluminum Base Material Copper Base Material
Thick Copper Halogen-Free Arlon Rogers CEM-1 CEM-3 Ceramics Flexible Rigid-flex |
Major Laminate
|
King Board (KB-6150/60), ShengYi (S1141, S1170) |
Surface Finish Treatment |
Flash gold (Electrolytic),
OSP
Chemical Gold
Hot Air Leveling (=HAL-Tin/Lead),
Hot Air Leveling (Lead- Free, RoHS),
Gold Fingers (30ยต") |
Via Holes
|
Copper PTH / Blind Via / Buried Via / HDI 2+N+2 with IVH |
Impedance l Control Tol.
|
+/-10% +/-5% |
Solder Mask
|
Liquid Photo-image (LPI) |
Profiling
|
CNC Routing, V-cutting, Punching, Push Back Punching, Connector chamfering |
Max. Board Size.
|
500 x 1000mm (20x40 inch) |
Min. Board Thickness.
|
0.4mm (2 layers) / 0.4mm (4 layers) / 0.9mm(8 layers) / 1.2mm (10 layers) / 1.3mm (12 layers) / 1.5mm (14 layers) / 1.7mm (16 layers) / 1.8mm / 2.0 mm (18 layers) / 2.2mm (20 layers) / 2.4mm ( 22 layers) / 2.6mm (24 layers) |
Copper Foil Thickness
|
18um / 35um / 70um ~ 245um (outerlayer:0.5oz~7oz)
18um / 35um / 70um ~ 210um (innerlayers:0.5oz~6oz) |
Min. Via Size and Type
|
Dia. 0.15mm (Finished);
Aspect Ratio <= 10 |
Min. Line width & Spacing
|
0.10 mm / 0.10 mm (4 mil./ 4 mil.) |
Minimum via hole size and pad
|
via: dia. 0.2mm / pad: dia. 0.4mm |
Minimum hole tolerance
|
+/-0.05mm(NPTH), +/-0.076mm(PTH) |
Hole wall to Conductor
|
0.20mm |
Hole to Hole Edge Gap
|
0.8mm |
Minimum Tooling Hole Diameter
|
0.15mm |
Minimum Legend Line width
|
0.15mm |
Dimensional Tolerance
|
Punching:+/-0.1mm;PTH(+/-0.076mm) by drilling; NPTH(+/-0.05mm) by drilling; NPTH(+/-0.1mm) by punching; Remark: 6.0mm hole tolerance by routing is +/-0.13mm |
Other Dimensions
|
Outline tolerance:+/-0.13mm for routing; +/-0.15mm for punching |
Minimum Annular Ring
|
Inner layer: / Outer layer: - Component holes: 0.13mm Via holes: 0.076mm |
Copper Thickness / Minimum Trace Width & Spacing
|
0.5oz/0.15mm, 1oz/0.15mm, 2oz/0.2mm, 4oz/0.38mm
|
Minimum SMT Pitch
|
0.4mm |
Minimum Soldermask Dam
|
Double sided: 0.25mm
Multilayer: 0.25mm |
Minimum Soldermask opening
|
Double sided: pad width 0.1mm Multilayer: 0.075mm |
Copper to Board Edge Gap
|
0.4mm |
Copper to Hole Gap
|
0.2mm |
Minimum Void/Thermal Gaps
|
0.2mmX0.2mm or (diameter=0.5mm) |
Acid Trap Closed
|
0.2mm |
Capacity
|
500,000 square feet (Month) |